Polysol P-10
Arsol 261 - Flux
Arsol 220 - Flux
Arsol 230- Flux
ARSOL 230 is a Halide Free No clean flux, with fine wetting properties, used for both Pb free and Sn/Pb soldering applications.
Can be applied by Foam, spray, Dipping and brushing application. Uniform coating of flux is required on the board to achieve good results. To meet electrical stability and consistent soldering performance, materials used shall comply with Ionic cleanliness.
| OPERATING PARAMETER | ||||
|---|---|---|---|---|
| Amount of Flux Applied | 1,200 – 2,000 μg/in2 solids | |||
| Top-Side Preheat Temperature | 85 - 120°C | |||
| Bottom side Preheat Temperature | 100 - 140°C | |||
| Maximum Ramp Rate of Topside Temperature (to avoid component damage) | 3°C/second (35°F/second) maximum | |||
| Contact Time in the Solder (includes Chip Wave and Primary Wave) | 3 – 6 seconds | |||
| Wave contact angle | 4° ~ 6° | |||
| Solder Pot Temperature: | 245-255°C for 63/37, 255-265°C for Lead Free SAC alloys. | |||
| These are general guidelines which have proven to yield excellent results; however, depending upon your equipment, components, and circuit boards, your optimal settings may be different. in order to optimize your process, it is recommended to perform a design experiment, optimizing the most important variables (amount of flux applied, conveyor speed, topside preheat temperature, solder pot temperature and board orientation). | ||||
| Appearance | Clear, light amber (Pale Yellow) color |
| Acid number mg KOH/g: | 18.5 +/- 1 |
| IPC-J-STD-0004 Designation: | ROL0 |
| Flash point: | 18°C |
| Solids Content, wt/wt | 4.0% |
| Ph (5% aqueous solution) | 3.3+/- 0.2 |
| Specific gravity @ 25°C: | 0.794 +/- 0.02 (Can maintain the specific gravity using IPA Ultra Pure in foam and dip soldering application). |
| Reliability: | Meets IPC, JIS for corrosion and copper mirror tests, Bellcore Surface Insulation Resistance and Electro migration requirements. |
| Shelf Life : | 18 months |
| IPC J-STD-004A Comb - UP and Down un-cleaned | Pass |
ARSOL-230 Flux is a no-clean, flux residues are designed to be left on the board. If desired, Flux residues can be removed with water Based cleaner AS Aqua Clean-7, Solvent based cleaners Biosol G-10, Biosol G-25 cleaner or EG grade IPA.
ARSOL-220 is recommended for hand soldering applications.
Packaging is available in 5 and 20 Litres.
ARSOL 261 is a Halide Free No clean flux, with fine wetting properties, used for both Pb free and Sn/Pb soldering applications. Specifically developed to deliver high reliability and excellent soldering performance combined with outstanding board cosmetics and pin-testability.
Can be applied by Foam, spray, Dipping and brushing application. Uniform coating of flux is required on the board to achieve good results. To meet electrical stability and consistent soldering performance, materials used shall comply with Ionic cleanliness.
| OPERATING PARAMETER | ||||
|---|---|---|---|---|
| Amount of Flux Applied | 1,250 – 1,800 μg/in2 solids | |||
| Top-Side Preheat Temperature | 90 - 120°C | |||
| Bottom side Preheat Temperature | 110 - 140°C | |||
| Maximum Ramp Rate of Topside Temperature (to avoid component damage) | 3°C/second (35°F/second) maximum | |||
| Contact Time in the Solder (includes Chip Wave and Primary Wave) | 3 – 6 seconds | |||
| Wave contact angle | 4° ~ 6° | |||
| Solder Pot Temperature: | 245-255C for 63/37, 255-265°C for Lead Free SAC alloys | |||
| These are general guidelines which have proven to yield excellent results; however, depending upon your equipment, components, and circuit boards, your optimal settings may be different. to optimize your process, it is recommended to perform a design experiment, optimizing the most important variables (amount of flux applied, conveyor speed, topside preheat temperature, solder pot temperature and board orientation). | ||||
| Appearance | Clear, colourless liquid |
| Acid number mg KOH/g: | 23 +/- 0.5 |
| IPC-J-STD-0004 Designation: | ORL0 |
| Flash point: | 15°C |
| Solids Content, wt/wt | 2 +/- 0.1 % |
| pH (5% aqueous solution) | 3.2 |
| Specific gravity @ 25°C: | 0.794 +/- 0.02 (Arsol-261 additive is recommended to maintain the specific gravity in foam & dip soldering). |
| Reliability: | Meets IPC, JIS for corrosion and copper mirror tests, Bellcore Surface Insulation Resistance and Electro migration requirements. |
| Shelf Life : | 18 months |
| IPC J-STD-004A Comb - UP and Down un-cleaned | Pass |
ARSOL-261 Flux is a no-clean, flux residues are designed to be left on the board. If desired, Flux residues can be removed with water Based cleaner AS Aqua Clean-7, Solvent based cleaners EF-10H, Biosol G-25 cleaner or EG grade IPA.
ARSOL-220 is recommended for hand soldering applications.
Packaging is available in 5 and 20 Litres.
POLYSOL-P10 is a is a high pure solvent used for dissolving urethanes, Rosin, silicones, anhydride- cure epoxies. It contains a proprietary blend of ingredients that facilitate polymer removal. can be used for non-cured conformal coating material cleaning applications. It removes effectively pre cured residues and other contaminants in PCBA and conformal coating equipment and printed circuit boards during assembly process.
PolySol-P10 cleaner can be used in following applications:
PolySol-P10 is suitable for use on the following metal surface, provided the surfaces are not heavily tarnished. Cadmium, OSP, Tin, Copper, Gold, Zinc and Silver.
can be used for non-cured conformal coating material cleaning applications. It removes effectively pre cured residues and other contaminants in PABA and conformal coating equipment and printed circuit boards during assembly process.
Can be applied by spray, Dipping and brushing application.
PolySol-P10 is excellent for chemical de-flashing of most plastics including Epoxy B-type materials. It will disintegrate many epoxy-moulded devices including UV-cured and amine-cured epoxies.
This solvent will remove many cured inks.
It is an effective solvent for removing moulded epoxy residue from moulds.
It is effective at softening and degasifying acrylic emulsions and other laminating or pressure-sensitive adhesives.
Can be use up to 140 ° C under a vented hood. Immerse component for 15-30 minutes. Rinse with water blow off any remaining flash with an air gun.
| Appearance: | Colourless liquid Molecular |
| Molecular weight | 68.10 |
| Boiling point | 160 ̊C |
| Flash point (Closed cup) | 48 ̊C (open cup) |
| Specific gravity @ 25°C | 0.90 – 0.92 |
| Water miscibility | Miscible easily |
| Shelf Life | 18 months |
Packaging is available in 5 and 20 Litres.
ARSOL 220 is a Halide and Halogen free, rosin/resin free, low solids, no-clean flux, with fine wetting properties, used for both Pb free and Sn/Pb applications.
It is formulated for wave and Selective soldering of through-hole, mixed technology, and surface mount assemblies. The flux produces a tack-free surface with high surface insulation resistance and truly little residue to interfere with electrical testing. The flux has been specifically formulated to resist degradation in surface insulation resistance and electro migration, even in situations where the flux does not experience soldering temperatures and when heavy levels of flux have been applied. The residues are non-corrosive and do not cause "greening" when in contact with copper or copperbearing alloys.
Particularly developed for touch-up/rework when supplied in a flux pen.
Can be applied by Foam, spray, Dipping and brushing application. Uniform coating of flux is required on the board to achieve good results. To meet electrical stability and consistent soldering performance, materials used shall comply with Ionic cleanliness.
| OPERATING PARAMETER | ||||
|---|---|---|---|---|
| Amount of Flux Applied | 1,200 2,000 μg/in2 solids | |||
| Top-Side Preheat Temperature | 90 - 120°C | |||
| Bottom side Preheat Temperature | 110 - 140C | |||
| Maximum Ramp Rate of Topside Temperature (to avoid component damage) | 3°C/second (35°F/second) maximum | |||
| Contact Time in the Solder (includes Chip Wave and Primary Wave) | 3 6 seconds | |||
| Wave contact angle | 4° ~ 6° | |||
| Solder Pot Temperature: | 245-255C for 63/37, 255-265°C for Lead Free SAC alloys. | |||
| Appearance: | Colour less |
|---|---|
| Acid number mg KOH/g: | 17.0 |
| IPC-J-STD-0004 Designation: | ORL0 |
| Flash point: | 15°C |
| Solids Content, wt/wt | 2.0% |
| Specific gravity @ 25°C: | 0.784 (Recommended additive: Arsol-220, to maintain the specific gravity in foam and dip soldering application). |
| Reliability : | Meets IPC, JIS for corrosion and copper mirror tests, Bellcore Surface Insulation Resistance and Electro migration requirements. |
| Shelf Life : | 18 months |
ARSOL-2200 Flux is a no-clean, flux residues are designed to be left on the board. If desired, Flux residues can be removed with water Based cleaner AS Aqua Clean-7, Solvent based cleaners Biosol G-10, Biosol G-25 cleaner or EG grade IPA.
ARSOL-220 is recommended for hand soldering applications.
Packaging is available in 5 and 20 Litres.
Dross Reducer Powder- 18 is a unique product Metals to give you the complete solutions to your dross problem.
It is a crystalline white, odourless, easy to use powder.
Handle using protective gloves and safety goggles. Apply by sprinkling uniformly onto the surface of the molten solder bath. Mix the powder into the dross with some chopping action. Before removing dross from the solder bath or when there is still some metallic pure solder in the dross, reduce it by mixing an additional quantity of Dross Reducer Powder and skim off the contaminated materials. Reapplication may be necessary after several hours of operation if dross begins to build up. Test and field results show you need 08 - 10 gm. for 250 kg solder pot. of solder for 8 hours.
Available in plastic jars of 1kg each
BIOSOL G-10 T is a high pure material with MildOrange flavour can be used for cleaning applications. This is an ideal replacement for hand wipe or immersion mineral spirits. It removes effectively post soldered residues and other contaminants in printed circuit boards during assembly and can be used to clean off solder paste raw residues and other contaminants.
Biosol G-10 T cleaner can be used in following applications:
PCBA cleaning application to remove the flux residues and meets ionic cleanliness in Post-Soldering Cleaning, Wave soldering Pallet Cleaning, Solder paste Stencil Cleaning, Wave soldering finger Cleaning and General-Purpose surface Cleaning.
Can be applied by spray, Dipping, Ultrasonic cleaning and brushing application.
| Appearance | Colourless liquid Molecular |
| Molecular weight | 55 |
| Boiling point | 72˚C |
| Flash point (Closed cup) | 38 ˚C (open cup) |
| Specific gravity @ 25°C | 0.78 – 0.82 |
| Water miscibility | Miscible easily |
| Shelf Life | 18 months |
Packaging is available in 5 and 20 Litres.
EF Cleaner-10 H is a high pure material with Orange flavour can be used for cleaning applications. This is an ideal replacement for hand wipe or immersion mineral spirits. It removes effectively post soldered residues and other contaminants in printed circuit boards during assembly and can be used to clean off solder paste raw residues and other contaminants.
EF Cleaner-10 H cleaner can be used in following applications:
PCBA cleaning application to remove the flux residues and meets ionic cleanliness in Post-Soldering Cleaning, Wave soldering Pallet Cleaning, Solder paste Stencil Cleaning, Wave soldering finger Cleaning and General-Purpose surface Cleaning.
Can be applied by spray, Dipping and brushing application.
| Appearance | Colourless liquid Molecular |
| Molecular weight | 66.10 |
| Boiling point | 92˚C |
| Flash point (Closed cup) | 55 ˚C (open cup) |
| Specific gravity @ 25C | 0.78 – 0.82 |
| Water miscibility | Miscible easily |
| Shelf Life | 18 months |
Packaging is available in 5 and 20 Litres.
AR- 339 BGA Paste Flux is NO-CLEAN and LEAD-FREE FLUX.
This Flux is developed to be used in the placement of lead-free solders balls in BGA attach processes, before reflow. And re-work of BGS and other find pitch SMT components
The flux may be applied by Brush, screen printing, pin transfer or doctor blade / dip coating methods.
Although the Flux designed as a no clean flux, the reflowed residue may be cleaned with EF-G10 H Cleaner. Production stencils or pin transfer equipment can be cleaned with EF-G10 H Cleaner or AS-7 Aqua-clean.
Available in plastic jars of 500 Gm and 100 Gm.
The flux should be stored in sealed containers and need not be refrigerated. Shelf life of unopened containers is nominally 1 months. If the material has been chilled, the container should be allowed to reach room temperature before opening, to prevent moisture condensation from ambient air onto the flux.
AR-339 flux is not considered toxic, its use in typical reflow processes will generate some decomposition and reaction vapours. These vapours should be adequately exhausted from the work environment and away from personnel. Refer the MSDS for additional safety information.
BIOSOL G-25 is a high pure material with orange flavour can be used for cleaning applications. This is an ideal replacement for hand wipe or immersion mineral spirits. It removes effectively post soldered residues and other contaminants in printed circuit boards during assembly and can be used to clean off solder paste raw residues and other contaminants.
Biosol G-25 cleaner is easy to handle and use in printing equipment and stencils on-board. Can be applied by spray, Dipping and brushing application
| Appearance | Colourless liquid Molecular |
| Molecular weight | 66.10 |
| Boiling point | 92˚C |
| Flash point (Closed cup) | 44˚C |
| Specific gravity @ 25C | 0.82 +/- 0.1 |
| Water miscibility | Miscible easily |
| Shelf Life | 18 months |
Packaging is available in 5 and 20 Litres.
Iso propyl alcohol is a high pure material with orange flavour can be used for cleaning applications. This is an ideal replacement for hand wipe or immersion mineral spirits. It removes effectively post soldered residues and other contaminants in printed circuit boards during assembly and can be used to clean off solder paste raw residues and other contaminants.
IPA E- cleaner is easy to handle and use in printing equipment and stencils on-board. Can be applied by spray, Dipping and brushing application
| Appearance | Colourless liquid Molecular |
| Molecular weight | 60.10 |
| Boiling point | 82˚C |
| Flash point (Closed cup) | 18C |
| Specific gravity @ 25°C | 0.781 – 0.783 |
| Water miscibility | Miscible easily |
| Purity | 99.99% |
| Shelf Life | 18 months |
| Viscosity @ 20 ˚ | C: 2.3 cP |
| Water | 0.1% max |
| Acidity | 0.03% max |
| Odour | Orange |
| Aldehydes & Ketones | 0.05% max |
| Evaporation rate | 1.7 (butyl acetate=1) |
| TLV | 980mg/m3 (TWA), 1225mg/m3 (STEL) |
Packaging is available in 5 and 20 Litres.
AS AQUA CLEAN-7 is a Halogen and Halide Free water based concentrated cleaner. Developed to remove the no-clean and water soluble flux residues from Pb free and Sn/Pb PCB and PCBA.
The cleaner is miscible with water, preferably concentrated cleaner can be use in 1: 4 to 7 (Water) ratios for manual, ultrasonic or conveyorised cleaning methods. Can go up to 25% of concentrated cleaner for strong residues, it is better to use DI water in the final stage of cleaning to avoid ionic contamination from tap water. The recommended temperature to use is maximum 40 to 70 °C. Multistage cleaning also can be performed depending on the cleaning requirement. To maintain the cleanliness level throughout the process concentrated cleaner can be added periodically to maintain the pH level 6 to 7.9.
| Odour: | Slight Ammonia |
| pH : | 8.6 +/- 0.4 |
| Density: | 1.0 g/cm3 at 25°C |
| Flash point: | None |
| Boiling point: | 95°C |
| Shelf Life : | 18 months |
Packaging is available in 5 and 20 Litres.